Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Record no. 315317)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00431nam a2200133Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230920s9999||||xx |||||||||||||| ||und|| |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780081025321 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Zhang, Hengyun |
| 245 #0 - TITLE STATEMENT | |
| Title | Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Date of publication, distribution, etc. | 2019 |
| Name of publisher, distributor, etc. | Woodhead Publishing |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Engineering 2019 |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://www.sciencedirect.com/science/book/9780081025321">https://www.sciencedirect.com/science/book/9780081025321</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | E-BOOKS |
No items available.