TY  - BOOK
AU  - Zhang, Hengyun
TI  - Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
SN  - 9780081025321
PY  - 2019///
PB  - Woodhead Publishing
KW  - Engineering 2019
UR  - https://www.sciencedirect.com/science/book/9780081025321
ER  -