E-H Wong and Y.-W. Mai <br/><br/>
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture 

 -  Woodhead Publishing  2015 
<br/><br/><label>ISBN: </label>9781845695286 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering 2015