TY  - BOOK
AU  - YongAn Huang, Zhouping Yin, Xiaodong Wan
TI  - Modeling and Application of Flexible Electronics Packaging
SN  - 978-981-13-3627-0
PY  - 2019///
PB  - Springer Singapore
UR  - https://doi.org/10.1007/978-981-13-3627-0
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-13-3627-0
ER  -