TY  - BOOK
AU  - Wei , Xing-Chang
TI  - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
SN  - 9781315305875
PY  - 2017///
PB  - CRC Press
KW  - Electrical
UR  - https://www.taylorfrancis.com/books/9781315305875
ER  -