Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich <br/><br/>
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments:  

 -  CRC Press  2022 
<br/><br/><label>ISBN: </label>9781003247005 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Mechanical Engineering