TY  - BOOK
AU  - Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich
TI  - Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments: 
SN  - 9781003247005
PY  - 2022///
PB  - CRC Press
KW  - Mechanical Engineering
UR  - http://www.taylorfrancis.com/books/9781003247005
ER  -