Beth Keser <br/><br/>
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package 

 -  Wiley-IEEE Press  2021 
<br/><br/><label>ISBN: </label>9781119793908 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Physical Sciences & Engineering