TY  - BOOK
AU  - Beth Keser
TI  - Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package
SN  - 9781119793908
PY  - 2021///
PB  - Wiley-IEEE Press
KW  - Physical Sciences & Engineering
UR  - https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
ER  -