TY  - BOOK
AU  - Brandon Noia, Krishnendu Chakrabarty
TI  - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
SN  - 978-3-319-02378-6
PY  - 2014///
PB  - Springer International Publishing
UR  - https://link.springer.com/openurl?genre=book&isbn=978-3-319-02378-6
ER  -