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Results of search for 'au:"Zhang, Hengyun"'
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Authors
Zhang, Hengyun
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E-BOOKS
Topics
Engineering 2019
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1.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
by
Zhang, Hengyun
Publication details:
Woodhead Publishing
2019
Online resources:
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2.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
by
Zhang, Hengyun
Publication details:
Woodhead Publishing
2019
Online resources:
Click here to access online
Availability:
No items available.
Add to cart
(remove)
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