| 000 | 00431nam a2200133Ia 4500 | ||
|---|---|---|---|
| 008 | 230920s9999||||xx |||||||||||||| ||und|| | ||
| 020 | _a9780081025321 | ||
| 100 | _aZhang, Hengyun | ||
| 245 | 0 | _aModeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore | |
| 260 |
_c2019 _bWoodhead Publishing |
||
| 650 | _aEngineering 2019 | ||
| 856 | _uhttps://www.sciencedirect.com/science/book/9780081025321 | ||
| 942 | _cEB | ||
| 999 |
_c235642 _d235642 |
||